Topic: Thermal Management in the AI Era

Thermal management materials are essential for next-generation electronics, energy systems, and high-performance computing. However, designing materials with high thermal conductivity, low interfacial resistance, reliability, and scalable manufacturability remains challenging due to the complex coupling among composition, structure, processing, and heat-transfer behaviour. This Special Issue focuses on AI-driven thermal management materials and particularly encourages studies that integrate computation, experiments, and practical applications for advanced thermal materials.

We invite contributions addressing, but not limited to, the following themes:

1. Materials data and databases for thermal management materials;

2. Machine learning for thermal property prediction and materials discovery;

3. AI-guided design of thermal interface materials and interfacial heat transfer;

4. AI-enabled phase-change, adaptive, and transient thermal regulation materials;

5. Data-driven design of heat spreaders, substrates, and packaging materials;

6. Application-oriented thermal management materials for AI devices and advanced electronic systems;

7. High-throughput experiments and AI-controlled characterization for thermal management materials.

Artificial intelligence (AI), thermal management materials, AI-driven materials design, computational engineering