fig8

From: Recent advances in aerosol jet printing: process, inks and flexible electronic applications

Figure 8. Metal-based and carbon-based aerosol jet inks. (A) AJP-based fabrication of integrated electronics using PI, AgNPs, CuNPs, and PEDOT:PSS for a multilayer circuit and electrode, together with sequential photographs showing the circuit-printing process using five layers and three materials^[108]. Reprinted with permission^[108]. Copyright 2024, ACS Applied Materials & Interfaces; (B) Schematic diagram of the AJP process using the MXene/Ag-Ag composite ink^[114]. Reprinted with permission^[114]. Copyright 2025, Chemical Engineering Journal. AJP: Aerosol jet printing; PI: polyimide; AgNPs: silver nanoparticles; CuNPs: copper nanoparticles; PEDOT:PSS: poly(3,4-ethylenedioxythiophene):poly(styrenesulfonate).